88W8782UB0-NAPC/AZ Overview
The 88W8782UB0-NAPC/AZ is a highly integrated wireless connectivity solution designed for industrial and consumer applications requiring robust Wi-Fi and Bluetooth performance. This advanced semiconductor device combines dual-band 802.11ac Wi-Fi capabilities with Bluetooth 5.0 support, enabling seamless device communication with enhanced data throughput and low latency. Its compact form factor and optimized power consumption make it ideal for embedded systems, IoT devices, and smart home applications. Designed and manufactured by الشركة المصنعة للدوائر المتكاملة, this product delivers reliable wireless performance with a focus on efficiency and ease of integration into diverse hardware platforms.
88W8782UB0-NAPC/AZ Technical Specifications
| المعلمة | المواصفات |
|---|---|
| Wireless Standards Supported | 802.11ac Wave 2 (Wi-Fi), Bluetooth 5.0 |
| Operating Frequency Bands | 2.4 GHz and 5 GHz dual-band support |
| Maximum Data Rate | Up to 867 Mbps (Wi-Fi) |
| Bluetooth Profile Support | BLE, BR/EDR, and Bluetooth 5.0 low energy |
| Host Interface | SDIO 3.0, UART, PCM |
| جهد إمداد الطاقة | 3.3 V nominal |
| نطاق درجة حرارة التشغيل | -40 درجة مئوية إلى +85 درجة مئوية |
| نوع الحزمة | QFN 48-pin, 6 mm x 6 mm |
88W8782UB0-NAPC/AZ Key Features
- Dual-band 802.11ac Wave 2 Wi-Fi: Enables high-speed wireless communication with data rates up to 867 Mbps, ensuring smooth streaming and fast data transfers in congested environments.
- Bluetooth 5.0 Support: Provides improved range and throughput for Bluetooth devices, enhancing connectivity for peripherals and IoT sensor networks.
- استهلاك منخفض للطاقة: Optimized design reduces energy usage, extending battery life in portable and embedded applications.
- Flexible Host Interfaces: Supports SDIO, UART, and PCM for versatile integration with various system architectures.
- Extended Operating Temperature: Reliable performance in industrial environments from -40??C to +85??C.
- حزمة QFN مدمجة QFN: Small footprint facilitates space-saving designs in compact devices and modules.
- Advanced Coexistence Mechanisms: Minimizes interference between Wi-Fi and Bluetooth radios for stable multi-radio operation.
88W8782UB0-NAPC/AZ Advantages vs Typical Alternatives
This device offers a superior combination of dual-band Wi-Fi and Bluetooth 5.0 connectivity within a single, compact package, reducing the need for multiple discrete components. Its low power consumption and extended temperature range provide a robustness that typical alternatives may lack, making it ideal for demanding industrial and IoT applications. Additionally, flexible host interfaces and advanced coexistence features ensure seamless integration and reliable wireless performance.
🔥 المنتجات الأكثر مبيعًا
التطبيقات النموذجية
- Embedded wireless modules for IoT devices requiring high data rate Wi-Fi and Bluetooth connectivity in a compact form factor.
- Smart home automation systems needing reliable dual-band Wi-Fi and low-power Bluetooth communication.
- Industrial control systems operating in harsh environments, leveraging extended temperature range and robust wireless links.
- Consumer electronics such as wireless speakers or wearables where efficient, integrated wireless solutions are critical.
88W8782UB0-NAPC/AZ Brand Info
The 88W8782UB0-NAPC/AZ is a product from الشركة المصنعة للدوائر المتكاملة, a recognized leader in semiconductor innovation focused on wireless connectivity solutions. This product line emphasizes integration, power efficiency, and robust performance to meet the evolving demands of industrial, consumer, and IoT markets. Backed by comprehensive technical support and proven manufacturing quality, the device helps engineers and designers accelerate product development cycles while maintaining high standards of reliability and performance.
الأسئلة الشائعة
What wireless standards does the 88W8782UB0-NAPC/AZ support?
This device supports dual-band 802.11ac Wave 2 Wi-Fi, operating on both 2.4 GHz and 5 GHz frequency bands, as well as Bluetooth 5.0. This enables simultaneous high-speed Wi-Fi connectivity and low-energy Bluetooth communication.
🌟 المنتجات المميزة
ما هي متطلبات مصدر الطاقة لهذا الجهاز؟
The semiconductor operates at a nominal supply voltage of 3.3 V. Its design emphasizes low power consumption to enhance energy efficiency, which is particularly valuable in battery-powered and portable applications.
What package type and size does this product come in?
It is housed in a QFN (Quad Flat No-lead) package with 48 pins, measuring 6 mm by 6 mm. This compact size supports integration into space-constrained systems without compromising functionality.
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Can this device operate reliably in extreme temperature conditions?
Yes, it supports an operating temperature range from -40??C to +85??C, making it suitable for industrial and outdoor applications where environmental conditions vary significantly.
What host interfaces are available for system integration?
The device offers multiple interfaces including SDIO 3.0 for high-speed data transfer, UART for serial communication, and PCM for audio or voice data, providing flexibility in connecting with various host processors and system architectures.
