88W8787LA16CBJ/AZ Overview
The 88W8787LA16CBJ/AZ is a highly integrated wireless communication IC designed for advanced connectivity solutions. Its robust architecture supports efficient data transmission with optimized power management, making it suitable for demanding industrial and commercial applications. Featuring advanced RF capabilities and flexible interface options, this device ensures reliable performance in complex network environments. Trusted for its compact form factor and scalable design, it enables seamless integration into various embedded systems. For detailed technical insights and sourcing, visit الشركة المصنعة للدوائر المتكاملة.
88W8787LA16CBJ/AZ Technical Specifications
| المعلمة | المواصفات |
|---|---|
| جهد التشغيل | 1.8 V ?C 3.3 V |
| نطاق التردد | 2.4 GHz ISM Band |
| معدل البيانات | Up to 150 Mbps |
| Modulation | OFDM, DSSS |
| الواجهة | SDIO 3.0, SPI |
| Transmit Power | Up to +18 dBm |
| Receiver Sensitivity | -90 dBm @ 54 Mbps |
| الحزمة | 16 mm x 16 mm LGA |
| درجة حرارة التشغيل | -40 درجة مئوية إلى +85 درجة مئوية |
88W8787LA16CBJ/AZ Key Features
- Advanced RF Integration: Integrates a high-performance RF transceiver enabling robust connectivity with minimal external components, reducing design complexity and cost.
- High Data Throughput: Supports data rates up to 150 Mbps, ensuring fast and reliable wireless communication for bandwidth-intensive applications.
- Flexible Interfaces: Compatible with SDIO 3.0 and SPI, allowing easy integration into diverse embedded platforms and microcontroller environments.
- نطاق جهد تشغيل واسع: Operates efficiently across 1.8 V to 3.3 V, offering compatibility with various power supply architectures.
- استهلاك منخفض للطاقة: Optimized power management circuits enable extended operation in battery-powered devices, enhancing overall system reliability.
- Robust Environmental Tolerance: Designed to function reliably within industrial temperature ranges from -40??C to +85??C, suitable for harsh operating conditions.
- Compact LGA Package: The 16 mm x 16 mm footprint facilitates space-saving PCB layouts without compromising performance.
88W8787LA16CBJ/AZ Advantages vs Typical Alternatives
This device offers superior receiver sensitivity and higher transmit power compared to typical alternatives, ensuring extended wireless range and stable connections. Its flexible interface options and low power operation provide designers with enhanced integration versatility and energy efficiency. Additionally, the compact LGA package supports miniaturized system designs, making it a reliable and cost-effective solution for modern wireless communication needs.
🔥 المنتجات الأكثر مبيعًا
التطبيقات النموذجية
- Embedded wireless modules for industrial automation requiring robust connectivity and extended temperature operation.
- High-speed data transfer in portable consumer electronics demanding efficient power management.
- IoT gateways and access points where reliable RF performance and compact size are critical.
- Wireless sensor networks operating in harsh environments requiring stable and low-power communication.
88W8787LA16CBJ/AZ Brand Info
This product is part of a portfolio developed by a leading semiconductor vendor specializing in wireless connectivity solutions. Known for innovation in RF design and system integration, the brand supports customers with high-performance ICs that address complex industrial and commercial communication challenges. The 88W8787LA16CBJ/AZ exemplifies the brand’s focus on combining advanced technology with reliability and ease of integration to empower next-generation connected devices.
الأسئلة الشائعة
What types of wireless protocols does this IC support?
The device supports standard wireless protocols operating in the 2.4 GHz ISM band, utilizing modulation schemes such as OFDM and DSSS. This enables compatibility with common Wi-Fi and proprietary wireless communication standards suitable for diverse applications.
🌟 المنتجات المميزة
Can this IC operate in extreme temperature environments?
Yes, it is specified to operate reliably within a temperature range from -40??C to +85??C, making it suitable for industrial and outdoor applications where environmental conditions can be harsh.
What interface options are available for system integration?
This IC supports SDIO 3.0 and SPI interfaces, providing flexible connectivity options for integration with various host processors, including microcontrollers and application processors commonly used in embedded systems.
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How does the device manage power consumption?
It features optimized power management circuitry that allows operation across a wide voltage range while minimizing power draw. This makes it ideal for battery-powered applications where energy efficiency is critical for extended device uptime.
What packaging options does this device come in?
The 88W8787LA16CBJ/AZ is supplied in a compact 16 mm by 16 mm Land Grid Array (LGA) package, facilitating high-density PCB layouts and reliable solder connections for demanding industrial-grade applications.
