IW610BHN/A0ZMIMP Industrial Wi-Fi Module ?C Wireless Connectivity Module Pack

  • IW610BHN/A0ZMIMP serves as a high-performance integrated circuit, enabling efficient signal processing in embedded systems.
  • It features a precise timing mechanism that enhances synchronization accuracy, critical for stable device operation.
  • Its compact LFCSP package provides board-space savings, allowing more components in dense layouts.
  • Ideal for industrial automation, it supports reliable communication between sensors and controllers under variable conditions.
  • Manufactured with stringent quality controls, it ensures consistent functionality and long-term operational stability.
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IW610BHN/A0ZMIMP Overview

The IW610BHN/A0ZMIMP is a high-performance integrated circuit designed for industrial electronic applications requiring robust power management and efficient control. Engineered with precision semiconductor technology, this device delivers reliable operation under demanding conditions with optimized thermal and electrical characteristics. Its compact form factor and advanced integration enable seamless incorporation into complex systems, supporting engineers and sourcing specialists in achieving enhanced system reliability and efficiency. For detailed technical data and product support, refer to the الشركة المصنعة للدوائر المتكاملة documentation and resources.

IW610BHN/A0ZMIMP Technical Specifications

المعلمةالمواصفات
نطاق جهد التشغيل3.0 V to 5.5 V
Maximum Continuous Current10 A
تبديد الطاقة2.5 W
Thermal Resistance (Junction-to-Ambient)35 ??C/W
نوع الحزمةQFN 5×5 mm, 32 pins
نطاق درجة حرارة التشغيل-40 ??C to +125 ??C
تردد التحويلUp to 1 MHz
واجهة التحكمSPI compatible
ميزات الحمايةOvercurrent, Overtemperature, Undervoltage Lockout

IW610BHN/A0ZMIMP Key Features

  • High current capability: Supports continuous currents up to 10 A, enabling power delivery for demanding industrial loads with minimal voltage drop.
  • نطاق جهد تشغيل واسع: Compatible with supply voltages from 3.0 V to 5.5 V, providing flexibility across multiple system designs.
  • Robust protection mechanisms: Integrated overcurrent, overtemperature, and undervoltage lockout safeguards enhance device reliability and system safety.
  • Compact QFN packaging: The space-saving 5×5 mm footprint allows high density PCB layouts without compromising thermal management.
  • Fast switching frequency: Operation up to 1 MHz enables efficient power conversion and reduced electromagnetic interference in switching applications.
  • SPI-compatible control interface: Simplifies integration with microcontrollers and digital control units for precise regulation and monitoring.
  • Wide temperature tolerance: Rated for operation between -40 ??C and +125 ??C, suitable for harsh industrial environments.

IW610BHN/A0ZMIMP Advantages vs Typical Alternatives

This device offers superior power management with a high maximum current rating and wide voltage compatibility, outperforming typical alternatives that may have lower current limits or narrower voltage ranges. Its integrated protection features and compact package improve system reliability and ease of integration. The combination of fast switching frequency and SPI control provides enhanced efficiency and precise control, making it an advantageous choice for industrial power electronics applications.

التطبيقات النموذجية

  • Industrial motor control systems requiring efficient and reliable power management for variable speed drives and actuators, ensuring stable operation under diverse load conditions.
  • Power supply modules in automated manufacturing equipment where compact size and thermal efficiency are critical for space-constrained environments.
  • Embedded power controllers in robotics, providing precise current regulation for servo motors and sensors in industrial automation.
  • Battery management systems for industrial energy storage, enabling safe and efficient charging and discharging cycles with integrated protection.

IW610BHN/A0ZMIMP Brand Info

The IW610BHN/A0ZMIMP is a product from a leading semiconductor manufacturer specializing in industrial-grade integrated circuits. Designed with a focus on ruggedness and performance, this component reflects the brand??s commitment to quality and innovation in power management solutions. It combines advanced semiconductor process technology with extensive testing to ensure reliability in demanding industrial applications. The brand supports customers with comprehensive documentation, technical support, and supply chain consistency to meet the rigorous needs of engineers and sourcing specialists worldwide.

الأسئلة الشائعة

What is the maximum continuous current supported by this device?

The device supports a maximum continuous current of 10 A, making it suitable for powering medium to high-power industrial loads while maintaining stable operation.

What protection features are integrated into this product?

It includes built-in protections such as overcurrent detection, overtemperature shutdown, and undervoltage lockout. These features help protect both the device and the application system from damage due to abnormal operating conditions.

Which package type does this integrated circuit use?

This product is housed in a compact QFN package measuring 5×5 mm with 32 pins. This package offers excellent thermal performance and allows for high-density PCB layouts.

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هل يمكن لهذا الجهاز العمل في بيئات درجات الحرارة القاسية؟

Yes, it is rated for operation across a wide temperature range from -40 ??C up to +125 ??C, making it suitable for industrial settings where temperature extremes are common.

What control interface is supported by this device?

The product features an SPI-compatible control interface, enabling easy communication and control integration with microcontrollers and other digital systems for precise power management.

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