BCM43238TBKMLWG Overview
The BCM43238TBKMLWG is a high-performance wireless communication IC designed for integration in advanced connectivity applications. Offering comprehensive support for multiple wireless standards, this device ensures robust data transmission and reception with enhanced signal integrity. Its compact package and optimized power consumption make it suitable for embedded systems requiring reliable Wi-Fi and Bluetooth coexistence. Engineers and sourcing specialists will appreciate the device??s scalable architecture and compatibility with various system designs, providing flexibility and streamlined integration. For detailed technical resources and procurement options, visit IC-Hersteller.
BCM43238TBKMLWG Technical Specifications
| Parameter | Spezifikation |
|---|---|
| Wireless Standards Supported | IEEE 802.11 b/g/n, Bluetooth 4.0 |
| Betriebsfrequenz | 2,4 GHz ISM-Band |
| Sendeleistung | Up to +20 dBm |
| Receive Sensitivity | -90 dBm (typical) |
| Schnittstelle | SDIO 3.0, UART |
| Stromversorgungsspannung | 3.3 V |
| Paket Typ | MLP (Micro Leadframe Package) |
| Betriebstemperaturbereich | -40??C bis +85??C |
| Datenrate | Up to 150 Mbps (802.11n) |
BCM43238TBKMLWG Key Features
- Multi-Protocol Support: Integrates both Wi-Fi 802.11b/g/n and Bluetooth 4.0, enabling seamless wireless communication in diverse environments and reducing the need for separate modules.
- High Sensitivity Receiver: Provides a receive sensitivity of -90 dBm, ensuring reliable data reception even in low-signal or noisy conditions, which is critical for maintaining connectivity.
- Niedriger Stromverbrauch: Optimized for power efficiency, this device helps extend battery life in portable and embedded systems, supporting longer operation without compromising performance.
- Compact MLP Package: The small form factor facilitates integration into space-constrained designs, making it ideal for modern IoT devices and embedded wireless solutions.
BCM43238TBKMLWG Advantages vs Typical Alternatives
This device distinguishes itself with superior integration of Wi-Fi and Bluetooth protocols in a single compact package, reducing board space and system complexity. Its enhanced receive sensitivity and transmit power deliver improved wireless range and signal quality over typical discrete solutions. Additionally, the low power design supports energy-efficient applications, making it a preferred choice for engineers seeking reliability and performance in industrial and consumer wireless modules.
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Typische Anwendungen
- Embedded wireless modules for IoT devices, enabling robust connectivity in smart home, industrial automation, and healthcare monitoring systems.
- Wireless communication interfaces in portable consumer electronics, supporting seamless Wi-Fi and Bluetooth data exchange.
- Network adapters and dongles requiring multi-standard wireless support with compact footprint and efficient power usage.
- Integration into industrial control systems where reliable and low-latency wireless communication is essential for operational efficiency.
BCM43238TBKMLWG Brand Info
The BCM43238TBKMLWG is developed by a leading semiconductor manufacturer renowned for its innovative wireless connectivity solutions. This product line emphasizes high integration, advanced RF performance, and power efficiency tailored for modern embedded systems. With a strong focus on quality and support, the brand provides comprehensive design resources and application support to facilitate rapid development and deployment of wireless-enabled products across various industries.
FAQ
What wireless standards does this device support?
The device supports IEEE 802.11 b/g/n Wi-Fi standards along with Bluetooth 4.0, enabling versatile wireless communication capabilities suitable for a wide range of applications.
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What is the operating frequency range of this wireless IC?
It operates primarily in the 2.4 GHz ISM band, which is standard for both Wi-Fi and Bluetooth communication protocols, ensuring broad compatibility with wireless networks and devices.
How does the BCM43238TBKMLWG handle power consumption?
The device is designed with power efficiency in mind, consuming minimal power during operation to extend battery life in portable and embedded systems without sacrificing wireless performance.
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What interface options are available for integration?
It supports SDIO 3.0 and UART interfaces, providing flexible connectivity options for communication with host processors and enabling easy integration into various system architectures.
What are the environmental operating conditions for this device?
The component is rated to operate within a temperature range of -40??C to +85??C, making it suitable for industrial and commercial applications requiring reliable performance under diverse environmental conditions.
