Technology Never Stands Still, and Neither Do We
Validated Mini-ITX platforms engineered for reliable deployment in industrial, edge, and embedded system environments.
Mini-ITX Product Specifications
Mini-ITX Board Specifications for Engineering Selection
Compare board size, processor class, memory layout, storage, I/O, DC input, and operating temperature before enclosure, power, and production decisions are frozen.
170×170 to 146×102 mm listed board sizes
9–28 V DC input options across listed models
-20 to 70°C listed operating ranges
Selection First
Compare the Parameters That Block a Design Decision
Start with the electrical and mechanical limits that can force a redesign: board outline, DC input, operating temperature, I/O count, memory layout, and storage interfaces.
| Model | CPU / Chipset | Memory | Storage | I/O Ports | DC Input | Size | Temp Range |
|---|---|---|---|---|---|---|---|
| MI-2100T | Intel Core i5-1245UE / H610 | 2× DDR4 SO-DIMM | 1× M.2 2280, 1× SATA | 6× USB, 2× LAN, HDMI, 2× COM | 12 V / 19 V | 170×170 mm | 0–60°C |
| MI-1900N | Intel N100 / Alder Lake-N | 1× DDR4 SO-DIMM | 1× M.2, 1× SATA | 4× USB, HDMI, 2× COM | 12 V | 170×120 mm | 0–60°C |
| SBC-A320 | AMD Ryzen V1605B / SoC | 4 GB LPDDR4 onboard | 1× SATA, eMMC | 4× USB, 1× LAN, DP, GPIO | 9–24 V DC | 146×102 mm | -20–70°C |
| SBC-N5095 | Intel Celeron N5095 / SoC | 1× DDR4 SO-DIMM | 1× SATA, 1× M.2 | 6× USB, HDMI, COM, DP | 12–24 V | 146×102 mm | 0–60°C |
| X9-FNLS | Intel N95 / SoC | 1× DDR4 | 1× M.2 SSD | 6× USB, 2× HDMI, 2× COM | 12 V only | 170×120 mm | 0–60°C |
| ODM-ITX-CML | Intel Core i3-10110U / Q370 | 2× DDR4 | 2× SATA, 1× M.2 | 8× USB, 2× COM, DP, LAN | 12–28 V | 170×170 mm | -20–70°C |
Release rule: use the production SKU datasheet and mechanical drawing as the final authority. Processor capability, board implementation, and production configuration are not interchangeable specifications.
Mechanical Fit
Board Outline Is Only the First Enclosure Constraint
Standard Mini-ITX Footprint
Use the SKU drawing for mounting-hole coordinates, rear-I/O cutout, connector overhang, heat-sink height, M.2 clearance, and cable exit direction.
Reduced-Depth Board Examples
A shorter PCB can reduce chassis depth, but it changes connector placement, cooling area, storage position, and service access compared with a 170×170 mm layout.
Compact SBC Examples
Do not reuse a Mini-ITX mounting pattern by assumption. Confirm standoffs, I/O plate geometry, thermal contact zones, and cable bend radius from the exact drawing.
| Requirement | What Depends on the Board/System | Choose Another Option When | Key Trade-Off |
|---|---|---|---|
| Shallow enclosure | Connector Z-height, cooler, SO-DIMM angle, M.2 stack, cable bend radius | The production drawing exceeds enclosure height or service clearance | Lower profile can reduce cooling volume and connector freedom |
| Fanless system | Processor power, VRM loss, chassis thermal path, ambient, sustained workload | The verified thermal path cannot keep the production workload inside limits | Passive cooling trades acoustic simplicity for thermal headroom |
| High I/O count | Controller topology, shared lanes, internal headers, port power, cable routing | Required devices cannot operate simultaneously on the implemented topology | More connectors consume routing area, bandwidth, and power budget |
Power Input
Match the Supply to the Exact DC Input Window
The current comparison includes fixed 12 V boards, 12/19 V options, and wider 9–24 V, 12–24 V, and 12–28 V inputs. These ranges are not interchangeable.
Input Voltage Is a Board-Level Specification
- Verify minimum and maximum input voltage on the production SKU.
- Confirm connector type, polarity, cable gauge, and source voltage at the board.
- Budget startup current for storage, USB devices, PCIe loads, and displays.
Power Checks Before Design Freeze
A nominal 24 V source does not prove compatibility. Check cable drop, brownout behavior, startup load, protection circuitry, and the board input window under the actual system harness.
Thermal Limits
Separate Board Temperature Rating from System Thermal Margin
0–60°C
Listed operating range for several current comparison rows.
-20–70°C
Listed operating range for SBC-A320 and ODM-ITX-CML.
System validation
Ambient, workload, enclosure, contact path, orientation, and test duration must match production use.
A board temperature range does not guarantee a sealed fanless system will pass. The CPU power state, VRM loss, storage heat, enclosure surface area, thermal interface, and sustained workload determine system margin.
I/O & Expansion
Count Ports Only After You Map Their Controllers and Headers
The listed matrix spans 4–8 USB ports, up to 2 LAN ports, up to 2 COM ports, HDMI or DisplayPort outputs, and GPIO on one compact SBC example.
USB
Separate rear ports from internal headers, identify shared hubs or controllers, and confirm simultaneous device bandwidth and 5 V power demand.
Multiple USB Port Design →Serial & GPIO
Confirm RS-232 versus RS-422/485 mode, header pinout, isolation requirements, transceiver population, and GPIO voltage before harness design.
Multiple Serial Ports →Ethernet & Expansion
NIC count alone does not define throughput. Check controller model, link speed, PCIe lane allocation, storage sharing, and expansion-slot requirements.
Network & Security Boards →Product Families
Shortlist by Constraint Before Comparing Individual SKUs
Fanless & Low-Power
Prioritize thermal path, processor power, and compact DC input.
Industrial I/O
Prioritize COM, GPIO, CAN, USB topology, and legacy device integration.
Network & Security
Prioritize NIC count, Ethernet speed, storage, lane allocation, and appliance topology.
Edge AI & Performance
Prioritize PCIe expansion, processor or accelerator power, memory, and sustained cooling.
Application-Specific
Prioritize the fixed I/O map, enclosure, display, vehicle, medical, or storage requirement.
Validation & Release
Freeze the Production SKU, Not a Marketing Description
Configuration Changes Must Be Visible in the Release Record
Changing a COM transceiver, storage device, memory module, BIOS build, display interface, or DC-input option can change validation scope. Record the exact populated configuration before qualification.
Minimum Evidence Before a Board Enters a Repeat Build
- Board SKU, PCB revision, BOM revision, and BIOS build
- Approved memory and storage configuration
- Power-input and startup-load verification
- Thermal test context and sustained workload
- I/O test map for populated ports and headers
- Change record for substitutions or firmware updates
Engineering FAQ
Mini-ITX Specification Questions with High Selection Intent
What are the exact dimensions of a Mini-ITX motherboard?
Standard Mini-ITX is 170 × 170 mm. This page also lists 170 × 120 mm and 146 × 102 mm boards; use the SKU drawing for mounting holes and connector clearance.
Can an industrial Mini-ITX board run from 12V or 24V DC?
Yes, on supported SKUs. Listed examples include 12 V only, 12/19 V, 9–24 V, 12–24 V, and 12–28 V inputs. Verify the exact board before wiring.
How much RAM can a Mini-ITX motherboard support?
Capacity depends on processor, chipset, and slot layout. Listed boards use one or two DDR4 SO-DIMMs or onboard LPDDR4. Verify maximum tested capacity and ECC support per SKU.
What temperature range should an industrial Mini-ITX support?
The listed examples include 0–60°C and -20–70°C ranges. Board rating alone is insufficient; validate the production enclosure, workload, thermal path, storage, and ambient conditions.
How many USB, LAN, and COM ports can Mini-ITX support?
Current listed examples span 4–8 USB, up to 2 LAN, and up to 2 COM ports. Confirm rear versus internal ports, controller sharing, bandwidth, and power per SKU.
Production Selection
Need the Exact Drawing, BIOS Baseline, or I/O Map?
Send the target processor, board size, power source, operating temperature, display and I/O map, storage, OS, and annual quantity so the correct production SKU can be checked.