23K256-I/SN Overview
The 23K256-I/SN is a high-performance memory device designed for diverse applications requiring efficient data storage. With its advanced features and robust architecture, it enables reliable data management in embedded systems, industrial automation, and consumer electronics. This chip offers seamless integration and enhanced performance, making it a suitable choice for engineers and designers seeking optimal solutions for their projects. Explore more at IC Manufacturer.
23K256-I/SN Key Features
- High Density: The device provides 256 Kbits of EEPROM storage, allowing for extensive data retention, which is essential for applications requiring significant memory capacity.
- Ease of Integration: With an industry-standard SPI interface, the 23K256-I/SN simplifies system design and reduces time-to-market for engineers, making it ideal for embedded applications.
- Low Power Consumption: Designed for efficient operation, this device ensures that systems remain energy-efficient, contributing to longer battery life in portable applications.
- Wide Operating Voltage Range: The 23K256-I/SN operates effectively across a wide voltage range, enhancing its compatibility with various electronic systems and applications.
23K256-I/SN Technical Specifications
Parameter | Specification |
---|---|
Memory Density | 256 Kbits |
Interface Type | SPI |
Operating Voltage | 1.8V to 5.5V |
Data Retention | 100 Years |
Write Endurance | 100,000 Cycles |
Temperature Range | -40??C to +85??C |
Package Type | SOIC-8 |
Access Time | 40 ns |
23K256-I/SN Advantages vs Typical Alternatives
The device stands out against typical alternatives by offering higher memory density and a more extensive operating voltage range. Its low power consumption ensures efficient performance, making it an excellent choice for battery-operated devices. Furthermore, the compatibility with a standard SPI interface facilitates easier integration into existing designs.
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Typical Applications
- Embedded Systems: The 23K256-I/SN is ideal for data logging, firmware storage, and parameter settings in microcontroller-based applications. Its high density and reliability make it a preferred choice for engineers.
- Industrial Automation: This memory device is utilized in control systems where data integrity and long-term storage are critical, ensuring operational efficiency.
- Consumer Electronics: The chip is suited for various consumer devices, enhancing performance and reliability in applications such as smart home products.
- Telecommunications: Used in communication equipment, it enables efficient data management for configuration and operational settings, ensuring seamless connectivity.
23K256-I/SN Brand Info
The 23K256-I/SN is manufactured by a leading semiconductor company recognized for its commitment to quality and innovation. This device reflects the brand’s dedication to providing reliable, high-performance memory solutions tailored to meet the evolving needs of engineers and designers across multiple industries.
FAQ
What is the primary use of the 23K256-I/SN?
The primary use of the 23K256-I/SN is in applications that require reliable data storage, including embedded systems, industrial automation, and consumer electronics, ensuring efficient data management and retention.
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What are the key benefits of using this memory device?
Key benefits include high memory density, low power consumption, a wide operating voltage range, and compatibility with the SPI interface, all contributing to efficient integration in various electronic designs.
Can the 23K256-I/SN be used in automotive applications?
Yes, the device can be used in automotive applications due to its wide temperature range and reliability, making it suitable for various automotive electronic control units.
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How does the 23K256-I/SN compare to other memory types?
Compared to other memory types, the 23K256-I/SN offers advantages in data retention, endurance, and power efficiency, making it a reliable choice for long-term data storage applications.
What is the package type for the 23K256-I/SN?
The device is available in an SOIC-8 package, which provides a compact form factor suitable for space-constrained applications while maintaining robust performance and reliability.