ASM3-SAC2-AJL0H Signal Amplifier Module ?C Compact SMT Package

  • The device processes signals efficiently, enabling precise control in embedded systems and automation tasks.
  • Its frequency response supports stable operation across relevant ranges, ensuring consistent performance in variable conditions.
  • The compact LFCSP package reduces board space requirements, facilitating integration into densely populated circuit designs.
  • Ideal for industrial sensor interfacing, it enhances data accuracy and system responsiveness in real-time monitoring setups.
  • Manufactured under stringent quality controls, the component maintains reliability throughout extended operational cycles.
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产品上方询盘

ASM3-SAC2-AJL0H Overview

The ASM3-SAC2-AJL0H is a high-performance semiconductor device engineered for precision and robustness in industrial applications. Designed to deliver consistent operation under demanding environmental conditions, it integrates advanced technology to ensure optimal functionality. Its compact form factor and reliable electrical characteristics make it ideal for engineers seeking a dependable solution for system integration. This device offers a balance of efficiency and durability, meeting stringent requirements for power management and signal integrity. For detailed technical support and sourcing, visit IC Manufacturer.

ASM3-SAC2-AJL0H Technical Specifications

ParameterValue
Package TypeSurface Mount (SMD)
Operating Voltage3.3 V ?? 10%
Operating Temperature Range-40??C to +85??C
Input CurrentMax 15 mA
Output CurrentMax 20 mA
Frequency RangeUp to 50 MHz
Signal TypeDigital CMOS
Mounting StyleAutomated Pick and Place Compatible

ASM3-SAC2-AJL0H Key Features

  • High-frequency operation: Supports signal frequencies up to 50 MHz, enabling fast data processing and communication in complex electronic systems.
  • Wide operating temperature range: Functions reliably from -40??C to +85??C, suitable for harsh industrial environments.
  • Low power consumption: Maintains input current below 15 mA, enhancing energy efficiency and reducing thermal stress on circuit boards.
  • Compact surface-mount package: Optimizes PCB space and supports automated assembly, improving manufacturing throughput and consistency.

ASM3-SAC2-AJL0H Advantages vs Typical Alternatives

This device offers enhanced sensitivity and stable performance across a broad temperature range, outperforming many comparable components. Its low power consumption reduces overall system energy use, while the compact package design facilitates high-density PCB layouts. The integration of digital CMOS technology ensures increased signal integrity and noise immunity, making it a reliable choice in industrial semiconductor applications.

Typical Applications

  • Industrial automation systems requiring precise digital signal processing and robust operation in variable temperature environments.
  • Embedded control units where power efficiency and compact component size are critical.
  • Communication devices needing reliable high-frequency signal handling and noise resistance.
  • Consumer electronics with automated assembly requirements and strict space constraints on PCB design.

ASM3-SAC2-AJL0H Brand Info

The ASM3-SAC2-AJL0H is a product from a trusted semiconductor manufacturer specializing in industrial-grade integrated circuits. This device represents the brand??s commitment to delivering high-quality, durable components tailored for demanding engineering applications. Built with stringent quality standards, it supports a wide range of industrial and commercial electronics projects, backed by comprehensive technical documentation and customer support.

FAQ

What is the maximum operating frequency supported by this component?

The device supports signal frequencies up to 50 MHz, which allows it to handle high-speed data processing and communication tasks effectively within industrial and embedded systems.

Can this device operate in extreme temperature conditions?

Yes, it is designed to function reliably across a wide temperature range from -40??C to +85??C, making it suitable for use in harsh environments typical of industrial applications.

What package type does the device come in, and how does that benefit manufacturing?

It is available in a surface-mount device (SMD) package, which supports automated pick-and-place assembly. This reduces manufacturing time and costs while ensuring consistent placement and soldering quality.

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产品中间询盘

How does the device??s power consumption compare to similar components?

The input current is limited to a maximum of 15 mA, which is relatively low. This efficiency helps reduce overall system power consumption and minimizes heat generation during operation.

Is this component suitable for use in communication systems?

Yes, its digital CMOS signal type and high-frequency capacity make it appropriate for communication applications that require stable and noise-immune signal processing under varying environmental conditions.

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