HTSICC4801EW/C7,02 Overview
The HTSICC4801EW/C7,02 is a high-performance semiconductor device designed for advanced industrial electronics applications. Engineered to deliver reliable operation in demanding environments, it offers precise electrical characteristics and robust packaging suitable for high-density circuit integration. This component ensures consistent performance with low power consumption and enhanced thermal stability, making it ideal for automation, control systems, and embedded electronics. Sourced from a reputable supplier, the device reflects stringent manufacturing standards and is supported by comprehensive technical documentation for seamless design-in processes. Learn more at Fabricante de CI.
HTSICC4801EW/C7,02 Technical Specifications
| Parámetro | Especificación |
|---|---|
| Tipo de envase | EW (Enhanced Wafer-level) Surface Mount |
| Número de agujas | 48 pins |
| Temperatura de funcionamiento | De -40 °C a +85 °C |
| Voltage Rating | 3.3 V DC nominal |
| Consumo actual | Max 150 mA |
| Data Interface | Standard industrial serial communication |
| Thermal Resistance (Junction to Ambient) | 35??C/W |
| Protección ESD | IEC 61000-4-2 Level 4 |
| Temperatura de almacenamiento | -55??C to +125??C |
HTSICC4801EW/C7,02 Key Features
- High pin density: Supports 48 pins in a compact EW package, enabling complex circuit designs with minimal PCB footprint.
- Amplia gama de temperaturas de funcionamiento: Ensures stable performance from -40??C up to 85??C, suitable for harsh industrial environments.
- Bajo consumo de energía: Maximum current draw of 150 mA reduces overall system power requirements and thermal load.
- Robust ESD protection: Complies with IEC 61000-4-2 Level 4 standards, enhancing device reliability against electrostatic discharge events.
- Optimized thermal management: Thermal resistance of 35??C/W facilitates efficient heat dissipation during continuous operation.
- Standard industrial serial interface: Ensures compatibility with common communication protocols for easy integration.
- Enhanced wafer-level packaging: Improves mechanical durability and solder joint integrity for long-term reliability.
HTSICC4801EW/C7,02 Advantages vs Typical Alternatives
This device offers a superior combination of compact packaging, extended temperature tolerance, and enhanced electrostatic protection compared to typical semiconductor alternatives. Its low power consumption and high pin count provide design flexibility, while the robust thermal characteristics and industrial-grade interface ensure dependable operation in demanding applications. These advantages support reduced system complexity and improved lifecycle performance.
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Aplicaciones típicas
- Industrial automation controllers: Ideal for embedded control units requiring reliable communication and stable operation under variable environmental conditions.
- Power management modules: Suitable for compact power regulation circuits demanding low power dissipation and high integration density.
- Sensor interface boards: Supports precise data acquisition with robust ESD protection in sensor signal conditioning.
- Embedded computing platforms: Enables high-density integration for industrial embedded systems with stringent thermal and electrical requirements.
HTSICC4801EW/C7,02 Brand Info
The HTSICC4801EW/C7,02 is manufactured by a leading semiconductor provider known for delivering high-quality integrated circuits optimized for industrial and automation applications. This product reflects the company??s commitment to innovation, reliability, and compliance with international standards. Designed with advanced fabrication technology, it supports engineers and system designers in achieving efficient, durable, and scalable electronic solutions. Comprehensive technical support and documentation accompany this product to facilitate smooth integration and maximize application success.
PREGUNTAS FRECUENTES
What is the maximum operating temperature for this device?
The device is rated for operation up to 85??C, making it suitable for most industrial environments where thermal stability is critical. It also supports operation down to -40??C to accommodate cold temperature conditions.
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How does the package type benefit the overall system design?
The EW (Enhanced Wafer-level) surface mount package offers a compact footprint with 48 pins, allowing for high-density circuit layouts. This reduces PCB space requirements and enhances mechanical robustness, resulting in more reliable solder joints and easier manufacturing.
What communication interfaces are supported by this semiconductor?
The component supports standard industrial serial communication protocols, which ensures compatibility with a wide range of automation and control systems, simplifying integration into existing architectures.
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How is the device protected against electrostatic discharge?
It meets IEC 61000-4-2 Level 4 ESD protection standards, providing strong immunity against electrostatic spikes that can damage sensitive semiconductor components. This enhances durability and reliability in electrostatically challenging environments.
Can this device be used in power-sensitive applications?
Yes, with a maximum current consumption of 150 mA and efficient thermal management, this semiconductor is optimized for low power operation, making it suitable for applications where energy efficiency and heat dissipation are important design considerations.
