KUP-11D55-12 Overview
The KUP-11D55-12 is a precision semiconductor device designed for high-performance industrial applications. It offers reliable operation within a defined voltage and current range, ensuring stable performance under varying environmental conditions. Engineered for seamless integration, this component supports efficient power management and signal processing in demanding electronic systems. Its robust construction and adherence to rigorous quality standards make it a preferred choice for engineers targeting optimized functionality and durability. For more detailed information and sourcing, visit Fabricant de circuits intégrés.
KUP-11D55-12 Technical Specifications
| Paramètres | Spécifications |
|---|---|
| Tension de fonctionnement | 12 V DC |
| Courant maximum | 55 A |
| Power Dissipation | Up to 200 W |
| Type d'emballage | TO-247 |
| Thermal Resistance (Junction to Case) | 0.5 ??C/W |
| Plage de température de fonctionnement | -40 ??C to +150 ??C |
| Switching Speed | Fast switching capability suitable for high-frequency applications |
| Tension d'isolement | 2500 V RMS |
KUP-11D55-12 Key Features
- High Current Handling: Supports currents up to 55 A, enabling robust power delivery for demanding industrial loads.
- Wide Operating Voltage: Operates reliably at 12 V DC, matching the voltage requirements of many control and power circuits.
- Efficient Thermal Management: Low thermal resistance (0.5 ??C/W) ensures effective heat dissipation, enhancing device longevity and reliability.
- Durable Package Design: The TO-247 package offers mechanical robustness and ease of mounting on heat sinks, facilitating integration in compact assemblies.
KUP-11D55-12 Advantages vs Typical Alternatives
This device excels by combining high current capacity with efficient thermal performance, offering greater reliability compared to typical alternatives. Its robust isolation voltage and fast switching features provide enhanced accuracy and safety in power management. These capabilities reduce system complexity and improve overall efficiency, making it ideal for industrial applications requiring dependable semiconductor components.
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Applications typiques
- Power converters and inverters for industrial motor drives, where stable current handling and fast switching are critical for performance and energy efficiency.
- Switching regulators in power supply units for industrial automation systems.
- High-current load switching in electric vehicles and battery management systems.
- Industrial lighting control systems requiring reliable voltage and current regulation.
KUP-11D55-12 Brand Info
The KUP-11D55-12 is part of a product line engineered by a leading semiconductor manufacturer committed to delivering high-quality industrial components. Designed with precision and reliability in mind, this product benefits from rigorous testing and quality assurance processes. Its construction reflects industry standards aimed at maximizing performance in harsh environments, making it a trusted choice among engineers and sourcing professionals worldwide.
FAQ
What is the maximum operating temperature for this semiconductor device?
The device supports an operating temperature range from -40 ??C up to +150 ??C, allowing it to function reliably in a wide variety of industrial environments, including those with high thermal stress.
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How does the thermal resistance rating affect device performance?
A thermal resistance of 0.5 ??C/W means the device can efficiently transfer heat from the junction to the case. This characteristic helps maintain lower junction temperatures during operation, improving reliability and preventing thermal-related failures.
Is this component suitable for high-frequency switching applications?
Yes, the device features fast switching capabilities that make it well-suited for high-frequency power conversion and switching regulator circuits commonly used in industrial power electronics.
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What type of package does this device use and why is it important?
The TO-247 package provides mechanical strength and allows for effective heat dissipation through easy mounting on heat sinks. This packaging supports the device??s ability to handle high power and improves thermal management in compact system designs.