88W8787-A16CBJ/BZ Overview
The 88W8787-A16CBJ/BZ is a highly integrated, high-performance wireless connectivity solution designed for modern industrial and consumer applications. Engineered to support advanced Wi-Fi and Bluetooth standards, it offers robust data throughput and low power consumption, making it suitable for embedded systems requiring reliable wireless communication. This device integrates multiple connectivity protocols into a compact footprint, simplifying system design and accelerating time-to-market. With its proven performance and flexibility, it serves as an optimal choice for engineers and sourcing specialists seeking efficient wireless module solutions from Produttore di circuiti integrati.
88W8787-A16CBJ/BZ Technical Specifications
| Parametro | Specifiche |
|---|---|
| Wireless Standards Supported | IEEE 802.11a/b/g/n/ac, Bluetooth 5.0 |
| Frequenza operativa | 2.4 GHz and 5 GHz bands |
| Transmit Power | Up to +20 dBm |
| Velocità dei dati | Up to 867 Mbps (Wi-Fi), 2 Mbps (Bluetooth) |
| Host Interface | SDIO 3.0 / PCIe |
| Tensione di alimentazione | 3.3 V ?? 0.3 V |
| Intervallo di temperatura operativa | Da -40 a +85 °C |
| Tipo di confezione | 16 mm x 16 mm BGA |
| Security Features | WPA3, WPA2, AES Hardware Encryption |
88W8787-A16CBJ/BZ Key Features
- Dual-band Wi-Fi support: Enables simultaneous operation on 2.4 GHz and 5 GHz bands, providing enhanced network flexibility and reduced interference for stable wireless connections.
- Integrated Bluetooth 5.0: Supports high-speed Bluetooth communication, which is essential for device pairing, data transfer, and low-energy applications in IoT systems.
- Basso consumo energetico: Designed with power optimization techniques that extend battery life in portable and embedded devices without compromising performance.
- High data throughput: Supports up to 867 Mbps on Wi-Fi, suitable for bandwidth-intensive applications such as video streaming and real-time data exchange.
- Robust security protocols: Implements advanced WPA3 and AES encryption standards to safeguard wireless communications against unauthorized access and cyber threats.
- Compact BGA package: The 16 mm x 16 mm form factor facilitates integration into space-constrained designs, reducing overall system size and complexity.
- Flexible host interfaces: Supports SDIO 3.0 and PCIe interfaces, enabling easy integration with a wide range of host processors and embedded platforms.
88W8787-A16CBJ/BZ Advantages vs Typical Alternatives
This device offers a superior combination of dual-band wireless connectivity and Bluetooth 5.0 integration within a compact package, outperforming typical alternatives through enhanced data rates and lower power consumption. Its advanced security features and flexible host interfaces provide engineers with a reliable, scalable solution that simplifies system design and improves overall device robustness in demanding industrial and consumer environments.
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Applicazioni tipiche
- Embedded wireless modules for industrial automation systems requiring reliable dual-band Wi-Fi and Bluetooth connectivity, ensuring seamless communication and control in harsh environments.
- IoT gateways and smart home devices that benefit from high data throughput and low power operation for extended battery life and fast wireless networking.
- Wearable technology and portable electronics where compact size and efficient wireless communication are critical design factors.
- Consumer electronics such as smart TVs and media players demanding robust, high-speed wireless connections for streaming and device interoperability.
88W8787-A16CBJ/BZ Brand Info
Manufactured by a leading integrated circuit supplier, this wireless connectivity solution is part of a comprehensive portfolio designed to address the evolving needs of wireless data transmission in industrial and consumer electronics. The product combines the latest Wi-Fi and Bluetooth standards with proven hardware reliability, backed by rigorous quality control and extensive technical support. Its brand reputation is built on delivering innovative semiconductor solutions that enable seamless connectivity and reliable performance worldwide.
FAQ
What wireless communication standards does this device support?
The device supports dual-band Wi-Fi standards IEEE 802.11a/b/g/n/ac along with Bluetooth 5.0, allowing versatile wireless communication across both 2.4 GHz and 5 GHz frequency bands. This ensures compatibility with most modern wireless networks and devices.
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What are the power requirements and operating conditions for this component?
It operates at a supply voltage of 3.3 V ?? 0.3 V and supports an operating temperature range from -40??C to +85??C, making it suitable for a wide range of industrial and commercial applications that experience varying thermal conditions.
How does this product enhance security in wireless communications?
The solution incorporates advanced security protocols such as WPA3, WPA2, and hardware-based AES encryption, which collectively provide robust protection against unauthorized access and ensure data confidentiality during wireless transmissions.
📩 Contattaci
What host interfaces are supported, and why is this important?
It supports SDIO 3.0 and PCIe interfaces, offering flexible connectivity with various host processors and embedded systems. This compatibility simplifies integration and supports high-speed data exchange critical for performance-sensitive applications.
What packaging options are available and how do they affect integration?
The device is packaged in a compact 16 mm x 16 mm BGA form factor, allowing for high-density PCB layouts and space-efficient designs. This helps engineers reduce overall system size, enabling integration into compact, portable, or space-constrained products.
