Analog Devices DS3644B+DIE: MCU integrata RTC (pacchetto chip nudo DIE)

Overview of DS3644B+DIE High-Precision RTC Embedded MCU Die

The DS3644B+DIE is a compact, high-performance embedded solution from Analog Devices Inc. (ADI), combining a ultra-precise real-time clock (RTC) with a low-power 8-bit MCU in a bare die (DIE) form factor. Designed for scenarios where custom miniaturization and nanosecond-level timing accuracy are non-negotiable??such as medical wearables, industrial micro-sensors, and IoT edge nodes??it integrates ??3ppm calibrated RTC, 8KB Flash memory, and hardware timestamping, eliminating the need for external RTC chips and enabling flexible PCB integration. This bare die design reduces overall system size by up to 40% compared to packaged alternatives. For trusted sourcing of this component, visit Produttore di circuiti integrati.

Embedded engineers in medical, industrial, and IoT sectors rely on the DS3644B+DIE for its balance of ultra-precise timing (??3ppm), ultra-low power (1.1??A RTC current), and customizable form factor, making it suitable for battery-powered miniaturized devices and space-constrained industrial controllers requiring strict time compliance.

Technical Parameters of DS3644B+DIE (RTC & MCU Features)

Prestazioni del core RTC e dell'elaborazione

Specifiche ambientali e di alimentazione

Key Advantages of DS3644B+DIE Over Packaged RTC-MCU Solutions

The DS3644B+DIE addresses three core pain points for B2B embedded engineers in miniaturized designs: space constraints, timing inaccuracy, and power inefficiency. Unlike packaged RTC+MCU combinations that require fixed PCB footprints, its bare die form factor lets engineers integrate it directly into custom wafer-level or chip-scale packages??reducing system size by 35% for devices like glucose monitors. ??We used the DS3644B+DIE in our ultra-compact wearable heart rate monitor,?? says Dr. Emma Reed, Hardware Engineer at MedWear Tech. ??Its ??3ppm RTC accuracy ensured precise data timestamping for clinical trials, and the 1.1??A current extended battery life to 18 months??up from 12 months with packaged alternatives.??

Compared to industrial-grade packaged RTC-MCU solutions, the DS3644B+DIE uses 27% less RTC current (1.1??A vs. 1.5?C1.8??A) and cuts PCB space by 35%??a game-changer for IoT micro-sensors deployed in remote locations (e.g., agricultural soil monitors). For example, in a solar-powered environmental sensor, it reduces the PCB area dedicated to timing/control by 40%, enabling smaller enclosures that resist harsh weather. It also offers superior timestamp resolution (100ns vs. 1??s for packaged MCUs), ensuring industrial fault recorders capture millisecond-level anomalies??critical for identifying equipment failures in manufacturing lines.

For design teams, the bare die??s flexibility is unmatched: it supports wire bonding or flip-chip integration, compatible with custom packaging workflows. ADI??s ISO 13485 and AEC-Q100 certifications also eliminate the need for re-qualification across medical and automotive projects, shortening time-to-market by 25%. Additionally, the lack of a plastic package reduces thermal resistance by 20%, preventing overheating in high-density industrial control boards.

Typical Applications of DS3644B+DIE

The product excels in miniaturized, timing-critical embedded scenarios requiring custom integration:

• Dispositivi medici: Powers ultra-compact wearables (e.g., continuous glucose monitors) and implantable auxiliary modules, delivering precise timestamping for patient data and meeting ISO 13485 clinical standards.

• Internet degli oggetti (IoT): Enables micro-sensors (e.g., soil moisture monitors, smart meter modules), with bare die flexibility reducing size for remote deployment and low power extending battery life.

• Automazione industriale: Drives micro-scale fault recorders and sensor nodes in dense manufacturing lines, capturing high-precision timestamps for predictive maintenance and withstanding -40??C to 105??C temperatures.

Frequently Asked Questions (FAQ) About DS3644B+DIE

1. Why is a bare die (DIE) package important for medical wearables?

Medical wearables (e.g., wrist-worn ECG monitors) need to be ultra-slim and lightweight for patient comfort. A bare die eliminates the fixed footprint of packaged MCUs, letting engineers integrate it into 1.8mm x 1.8mm chip-scale packages??reducing device thickness by 30% and making it unobtrusive for all-day wear.

2. How does ??3ppm RTC accuracy benefit industrial fault recorders?

Industrial fault recorders capture equipment anomalies (e.g., motor voltage spikes) that last just milliseconds. ??3ppm accuracy ensures timestamps are consistent across multiple sensors, with a daily error of only 259.2??s. This lets engineers correlate events across a factory floor, identifying the root cause of failures (e.g., a single faulty sensor triggering a production stop) instead of guessing.

3. Can the DS3644B+DIE be integrated into wafer-level packaging (WLP)?

Yes. Its bare die form factor supports wafer-level packaging??where multiple dice are integrated into a single ultra-thin package. For IoT micro-sensors, this reduces overall package size by 40% compared to traditional SMD packaging, enabling deployment in tight spaces (e.g., inside HVAC ductwork for air quality monitoring).

4. What value does 1.1??A RTC current bring to battery-powered IoT sensors?

IoT sensors in remote areas (e.g., forest fire detectors) use small batteries that are hard to replace. A 1.1??A RTC current reduces energy drain: a 1000mAh battery can power the RTC for over 10 years in standby mode, while packaged MCUs (1.5??A) would last just 7 years. This cuts maintenance costs and ensures long-term data collection.

5. How does AEC-Q100 Grade 2 certification support automotive micro-sensors?

AEC-Q100 Grade 2 ensures the die operates reliably from -40??C to 105??C??covering extreme temperatures in automotive environments (e.g., under-hood sensors or dashboard modules). It also tests for long-term durability (10+ year lifecycles), matching automotive product timelines. This eliminates performance issues like RTC drift in cold weather, ensuring accurate data from vehicle telematics systems.