88W8987-A2-EAHE/AZ Wi-Fi 6E Wireless Module – Embedded OEM Package

  • This device integrates wireless connectivity to enable seamless communication in embedded systems.
  • It supports advanced protocols ensuring stable and efficient data transmission for critical applications.
  • The compact LFCSP package reduces board space, facilitating design flexibility in constrained environments.
  • Ideal for IoT devices requiring reliable network access and low latency in real-time data exchange.
  • 일관된 성능과 장기적인 신뢰성을 유지하기 위해 엄격한 품질 관리하에 제조됩니다.
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产品上方询盘

88W8987-A2-EAHE/AZ Overview

The 88W8987-A2-EAHE/AZ is a high-performance wireless connectivity solution designed for advanced industrial and commercial applications. This device integrates robust features that enable reliable and efficient data transmission in demanding environments. It supports multiple wireless protocols, ensuring flexible deployment options and compatibility with various network architectures. Engineered for low power consumption and high integration, it simplifies system design while maintaining excellent signal integrity. With comprehensive support for security and connectivity, this product meets the stringent requirements of modern industrial communication systems. For detailed technical insights and sourcing, visit IC 제조업체.

88W8987-A2-EAHE/AZ Technical Specifications

매개변수사양
Wireless Standards Supported802.11ac Wave 2, Bluetooth 5.0
Frequency Bands2.4 GHz and 5 GHz dual-band support
Maximum Data RateUp to 1.73 Gbps (PHY rate)
Transmit PowerUp to +20 dBm
Receiver Sensitivity-90 dBm typical
인터페이스 유형SDIO 3.0 / PCIe Gen2
작동 전압3.3 V ?? 5%
패키지 유형QFN 7 x 7 mm
작동 온도 범위-40??C ~ +85??C

88W8987-A2-EAHE/AZ Key Features

  • Dual-band wireless connectivity: Enables simultaneous 2.4 GHz and 5 GHz operation, providing flexible deployment options and improved network performance.
  • 높은 데이터 처리량: Supports up to 1.73 Gbps PHY rate, ensuring fast and efficient data transmission for bandwidth-intensive applications.
  • 낮은 전력 소비: Optimized for energy efficiency, extending device battery life and reducing system power requirements in portable and embedded designs.
  • Robust security integration: Supports advanced encryption and authentication protocols, protecting data integrity and network access.
  • Compact package design: Small QFN footprint facilitates easy integration into space-constrained industrial and commercial applications.
  • 넓은 작동 온도 범위: Suitable for harsh environments, ensuring reliable performance from -40??C to +85??C.
  • Flexible interface options: SDIO 3.0 and PCIe Gen2 interfaces provide high-speed connectivity with host processors.

88W8987-A2-EAHE/AZ Advantages vs Typical Alternatives

This wireless module offers superior sensitivity and data throughput compared to typical alternatives, enabling more reliable connections even in challenging RF environments. Its dual-band capability and flexible interfaces simplify system design while maintaining low power consumption, making it ideal for industrial applications where efficiency and integration are critical. The extended temperature range and compact package enhance robustness and ease of deployment.

일반적인 애플리케이션

  • Industrial automation systems requiring reliable, high-speed wireless communication to support real-time data exchange and control functions.
  • Enterprise-grade wireless access points and routers that demand dual-band support and high data rates for seamless network performance.
  • IoT devices in commercial environments where low power consumption and secure connectivity are essential for long-term operation.
  • Embedded systems in automotive or transportation sectors needing robust wireless links capable of operating across wide temperature ranges.

88W8987-A2-EAHE/AZ Brand Info

The 88W8987-A2-EAHE/AZ is part of a well-established portfolio from a leading semiconductor provider specializing in wireless connectivity solutions. This product reflects the brand??s commitment to delivering advanced, reliable, and energy-efficient components tailored for industrial and commercial markets. The device benefits from rigorous quality controls and extensive support resources, ensuring consistent performance and ease of integration for engineers and sourcing specialists.

자주 묻는 질문

What wireless protocols does this module support?

The device supports IEEE 802.11ac Wave 2 for Wi-Fi connectivity and Bluetooth 5.0 for short-range wireless communication, offering versatile options for dual-band operation and flexible network architectures.

What interfaces are available for connecting this module to a host system?

This model provides both SDIO 3.0 and PCIe Gen2 interfaces, enabling high-speed data transfer and compatibility with a wide range of processor platforms in embedded and industrial applications.

Can this product operate reliably in harsh industrial environments?

Yes, it is rated for an operating temperature range from -40??C to +85??C, making it suitable for deployment in demanding conditions where temperature fluctuations are common.

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产品中间询盘

How does the low power consumption benefit system design?

Lower power usage extends the battery life of portable devices and reduces thermal management requirements, which simplifies hardware design and enhances overall system efficiency.

What packaging format is used and why is it important?

The module comes in a compact QFN package measuring 7 x 7 mm, allowing integration into space-constrained applications while maintaining excellent thermal and electrical performance.

애플리케이션

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