ASMB-LTD3-0C3F3 Overview
The ASMB-LTD3-0C3F3 is a high-performance semiconductor device designed for advanced industrial and electronics applications. It offers precise control and reliable operation in demanding environments, making it suitable for integration within complex systems. With a compact footprint and robust electrical characteristics, this device ensures efficient power management and signal integrity. Engineers and sourcing specialists benefit from its well-documented specifications and consistent manufacturing quality, providing confidence in long-term deployment. For more detailed information on semiconductor solutions, visit IC 제조업체.
ASMB-LTD3-0C3F3 Technical Specifications
| 매개변수 | 사양 |
|---|---|
| 패키지 유형 | Surface Mount Device (SMD) |
| 작동 전압 | 3.3 V ?? 5% |
| 작동 온도 범위 | -40??C ~ +85??C |
| Maximum Current | 150 mA |
| Signal Type | Digital Input/Output |
| Response Time | 10 ns |
| 전력 손실 | 250 mW |
| ESD 보호 | ?? 2kV 인체 모델 |
ASMB-LTD3-0C3F3 Key Features
- High-Speed Switching: Enables rapid signal processing, improving overall system responsiveness and reducing latency in real-time applications.
- 낮은 전력 소비: Designed to operate efficiently at 3.3 V, minimizing energy use and thermal output, which extends device lifespan and lowers operational costs.
- Robust ESD Protection: Integrated electrostatic discharge safeguards enhance reliability and prevent damage during handling and assembly.
- 넓은 작동 온도 범위: Suitable for industrial environments, ensuring stable performance from -40??C to +85??C without degradation.
ASMB-LTD3-0C3F3 Advantages vs Typical Alternatives
This device stands out with its balanced combination of sensitivity, low power consumption, and fast response time compared to typical alternatives. Its robust ESD protection and extended temperature range provide enhanced reliability, making it ideal for harsh industrial conditions. The compact SMD package also facilitates easier integration into space-constrained designs, optimizing both performance and manufacturing efficiency.
베스트셀러 제품
일반적인 애플리케이션
- Industrial Control Systems: Used for precise digital signal processing and control logic in automated machinery, ensuring reliable operation under variable environmental conditions.
- Embedded Electronics: Integrates seamlessly within embedded systems requiring low power and high-speed digital interfacing.
- Consumer Electronics: Suitable for use in compact devices where power efficiency and fast switching are critical.
- Communication Equipment: Supports data transmission and signal integrity in network hardware and peripheral devices.
ASMB-LTD3-0C3F3 Brand Info
The ASMB-LTD3-0C3F3 is part of a series of semiconductor components developed to meet stringent industrial standards. Manufactured with precision and quality control, it reflects the brand??s commitment to delivering durable and efficient solutions for electronics engineers and system designers. The product??s consistent performance and detailed documentation make it a trusted choice for a wide range of technical applications.
자주 묻는 질문
이 장치의 일반적인 작동 전압 범위는 어떻게 되나요?
The device operates typically at 3.3 volts with a tolerance of ??5%. This voltage level ensures compatibility with many modern digital systems while maintaining low power consumption.
🌟 주요 제품
Can the device operate in harsh environmental conditions?
Yes, it supports an operating temperature range from -40??C to +85??C, making it suitable for industrial and outdoor environments where temperature fluctuations are common.
How does the device handle electrostatic discharge (ESD)?
It includes built-in ESD protection rated at ??2 kV under the Human Body Model, enhancing its durability during assembly and in-field operation against static discharge events.
📩 문의하기
Is this component suitable for high-speed digital applications?
Absolutely. With a response time of 10 nanoseconds, it supports fast switching and rapid data processing, essential for high-speed digital signal applications.
What packaging format does it use, and how does this benefit integration?
The component is supplied in a surface mount device (SMD) package, which allows for compact board layouts, automated assembly, and improved thermal management in dense electronic designs.