BCM43217TKMLGT Wi-Fi Combo IC Module ?C Wireless Connectivity, QFN Package

  • Provides integrated wireless connectivity to enable seamless data transmission in embedded systems.
  • Supports high-speed data rates essential for responsive network performance and efficient communication.
  • Features a compact package that saves board space, facilitating smaller device designs.
  • Ideal for IoT devices requiring stable wireless connections to improve real-time monitoring and control.
  • Manufactured to meet quality standards ensuring consistent operation and long-term reliability.
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产品上方询盘

BCM43217TKMLGT Overview

The BCM43217TKMLGT is a highly integrated wireless communication solution designed to support dual-band 2.4 GHz and 5 GHz Wi-Fi connectivity. This device is tailored for embedded applications requiring reliable, low-power wireless performance with support for multiple interfaces including SDIO and USB. Its compact package and efficient power management features make it suitable for industrial and consumer electronics where space and energy efficiency are critical. Supported by robust firmware and driver ecosystems, this module offers seamless integration for advanced networking applications. For more details, visit the IC-fabrikant website.

BCM43217TKMLGT Technical Specifications

ParameterSpecificatie
Frequency Bands2.4 GHz and 5 GHz dual-band
Wireless StandardsIEEE 802.11a/b/g/n
Interface TypesSDIO 3.0, USB 2.0
ZendvermogenUp to 17 dBm (typical)
Receive Sensitivity-90 dBm (typical)
Type verpakkingQFN (Quad Flat No-lead), 40-pin
Bedrijfsspanning3.3 V supply
StroomverbruikLow power modes supported, typical active current ?? 160 mA
Security SupportWPA, WPA2, WEP

BCM43217TKMLGT Key Features

  • Dual-Band Wireless Support: Enables simultaneous operation on both 2.4 GHz and 5 GHz bands, providing improved network flexibility and reduced interference for high-quality connectivity.
  • Multi-Interface Compatibility: Supports both SDIO and USB interfaces, facilitating easy integration into a wide range of embedded systems and host platforms.
  • Low Power Operation: Incorporates advanced power management to minimize energy consumption during active and idle states, extending battery life in portable devices.
  • Compact QFN Package: The small form factor simplifies PCB layout and reduces overall system size, ideal for space-constrained applications.

BCM43217TKMLGT Advantages vs Typical Alternatives

This wireless module offers significant advantages over typical alternatives by combining dual-band operation with versatile interface options like SDIO and USB. Its low power consumption and high receive sensitivity ensure reliable communication with reduced energy costs. The compact package and integrated security features enhance design flexibility and system robustness, making it a superior choice for modern embedded wireless applications.

Typische toepassingen

  • Embedded wireless networking in industrial control systems, where reliable dual-band Wi-Fi connectivity is essential for remote monitoring and data exchange.
  • Consumer electronics such as smart home devices requiring seamless wireless integration and low power consumption.
  • Portable handheld devices benefiting from the module??s compact size and efficient power management.
  • Wireless routers and access points that leverage dual-band capabilities for improved network performance.

BCM43217TKMLGT Brand Info

This module is a product from a leading IC manufacturer specializing in high-performance wireless communication solutions. Known for innovation and reliability, the brand offers comprehensive support including firmware updates and technical documentation to facilitate seamless integration. The BCM43217TKMLGT reflects the company??s commitment to delivering cutting-edge semiconductor products designed for demanding industrial and consumer markets.

FAQ

What wireless standards does the BCM43217TKMLGT support?

The device supports IEEE 802.11a/b/g/n wireless standards, enabling compatibility with a broad range of Wi-Fi networks across both the 2.4 GHz and 5 GHz frequency bands. This ensures flexible connectivity options for various applications.

Which interface options are available for integrating this module?

Integration is supported through SDIO 3.0 and USB 2.0 interfaces, allowing for adaptable connectivity with different host processors or systems. This flexibility simplifies system design and broadens the potential use cases.

How does the BCM43217TKMLGT manage power consumption in embedded systems?

It features advanced power management modes to reduce current draw during idle and active states. Typical active current consumption is 160 mA or less, making it suitable for battery-powered devices where energy efficiency is critical.

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产品中间询盘

What packaging format does this wireless module use?

The module is housed in a 40-pin QFN (Quad Flat No-lead) package. This compact form factor facilitates easy PCB integration while maintaining excellent electrical performance and thermal dissipation.

Is security supported on this wireless device?

Yes, security protocols including WPA, WPA2, and WEP are supported to ensure secure wireless communication. This is essential for protecting data and maintaining network integrity in various applications.

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