24FC512T-I/SN EEPROM Memory Chip – 512Kb I2C Interface – SOIC-8 Package

  • The 24FC512T-I/SN offers reliable EEPROM storage for various applications, ensuring data retention over time.
  • With high-density memory, it allows for efficient data storage in limited space, optimizing design layouts.
  • This component comes in a compact package, promoting board-space savings and simplifying integration.
  • Ideal for embedded systems, it helps maintain critical settings even during power loss, enhancing system stability.
  • Manufactured to strict standards, it ensures lasting performance and durability in demanding environments.
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产品上方询盘

24FC512T-I/SN Overview

The 24FC512T-I/SN is a highly efficient 512 Kbit EEPROM designed for various industrial and consumer applications. Offering reliable data storage with low power consumption, this component ensures optimal performance in embedded systems. Its integrated features allow for seamless interfacing with microcontrollers, making it a preferred choice for engineers and designers. For more information, visit Fabricante de CI.

24FC512T-I/SN Key Features

  • High Storage Capacity: With 512 Kbits of memory, this EEPROM provides ample data storage for complex applications, reducing the need for multiple chips.
  • Low Power Operation: The device operates at minimal power levels, which is crucial for battery-powered devices, enhancing overall energy efficiency.
  • Easy Integration: Designed for straightforward interfacing with various microcontrollers, it simplifies the design process and reduces development time.
  • Robust Reliability: This EEPROM is built to withstand industrial conditions, ensuring data integrity over a prolonged lifespan.

24FC512T-I/SN Technical Specifications

ParâmetroValor
Tamanho da memória512 Kbit
Data FormatByte
Tipo de interfaceI2C
Tensão de funcionamento1.7V to 5.5V
Write Cycle Time5 ms (typical)
Conservação de dados100 years
Gama de temperaturas-40??C a +85??C
Tipo de embalagemSOIC-8

24FC512T-I/SN Advantages vs Typical Alternatives

Compared to typical alternatives, this EEPROM offers superior data retention and power efficiency. Its robust operating voltage range allows for greater versatility in demanding applications, ensuring reliable performance even under challenging conditions.

Aplicações típicas

  • Automação industrial: Used in control systems for storing configuration settings and operational data, ensuring quick access and reliability in industrial environments.
  • Consumer Electronics: Ideal for devices requiring non-volatile memory to retain user settings even after power loss.
  • Automotive Systems: Suitable for applications needing reliable data storage under varying temperature ranges.
  • Smart Home Devices: Can be implemented in smart appliances for storing user preferences and operational data.

24FC512T-I/SN Brand Info

The 24FC512T-I/SN is manufactured by a leading semiconductor company known for producing high-quality memory solutions. This product exemplifies the brand’s commitment to innovation, reliability, and performance in the field of electronics.

FAQ

What is the maximum write cycle endurance of the 24FC512T-I/SN?

The maximum write cycle endurance of this EEPROM is typically 1,000,000 write cycles, ensuring longevity and reliability for applications requiring frequent updates.

Can the 24FC512T-I/SN operate at lower voltages?

Yes, the device can operate within a voltage range of 1.7V to 5.5V, making it versatile for a variety of applications, including battery-operated devices.

What communication protocol does the 24FC512T-I/SN use?

This EEPROM uses the I2C communication protocol, allowing for easy integration with microcontrollers and other digital devices.

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产品中间询盘

Is the 24FC512T-I/SN suitable for automotive applications?

Yes, it is suitable for automotive applications due to its wide temperature range of -40??C to +85??C, ensuring reliability in harsh environments.

What package type is available for the 24FC512T-I/SN?

The device is available in a SOIC-8 package, which provides a compact solution for space-constrained applications while ensuring effective thermal performance.

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