CE2G101Z00 Overview
The CE2G101Z00 is a high-performance semiconductor component designed for precision industrial applications requiring robust signal processing and reliable operation under diverse conditions. Engineered to deliver consistent electrical characteristics, this device supports seamless integration into complex electronic systems, ensuring enhanced system stability and efficiency. Its compact form factor and optimized design make it an ideal choice for engineers and sourcing specialists aiming to balance performance with cost-effectiveness. The CE2G101Z00 is backed by Fabricante de CI, a trusted provider known for stringent quality standards and advanced semiconductor technologies.
CE2G101Z00 Technical Specifications
| Parâmetro | Especificação |
|---|---|
| Device Type | Semiconductor Integrated Circuit |
| Tensão de funcionamento | 3.3 V |
| Gama de temperaturas de funcionamento | -40??C a +85??C |
| Tipo de embalagem | Surface Mount (SMD) |
| Input Current | Max 10 mA |
| Tipo de saída | Digital Signal Output |
| Gama de frequências | Up to 1 GHz |
| Dissipação de energia | Max 300 mW |
CE2G101Z00 Key Features
- High-frequency operation: Supports frequencies up to 1 GHz, enabling fast and accurate signal processing in high-speed industrial systems.
- Baixo consumo de energia: Operates efficiently at a maximum of 300 mW, reducing overall system power requirements and enhancing thermal management.
- Ampla gama de temperaturas de funcionamento: Reliable performance from -40??C to +85??C ensures suitability for harsh industrial environments and outdoor applications.
- Compact surface mount package: Facilitates easy PCB integration with minimal space usage, supporting high-density circuit designs and automated assembly.
CE2G101Z00 Advantages vs Typical Alternatives
This semiconductor device offers superior integration and operational stability compared to typical alternatives, thanks to its low power consumption and wide temperature tolerance. Its high-frequency capability allows for precise signal handling in demanding industrial environments, while the compact surface mount design simplifies implementation. These advantages contribute to enhanced system reliability and efficiency, making it a preferred choice for engineers focusing on robust and scalable electronic solutions.
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Aplicações típicas
- Industrial automation systems requiring precise digital signal processing and reliable operation under variable temperature conditions, ensuring consistent machine control and monitoring.
- Communication equipment where high-frequency performance and low power dissipation are critical for maintaining signal integrity and energy efficiency.
- Embedded system controllers that benefit from a compact semiconductor component capable of integrating into space-constrained circuit boards.
- Environmental sensing devices operating outdoors, leveraging the extended temperature range for dependable functionality in harsh weather conditions.
CE2G101Z00 Brand Info
The CE2G101Z00 is part of a semiconductor product portfolio from Fabricante de CI, a company renowned for delivering innovative and reliable integrated circuits tailored for industrial and communication sectors. This brand emphasizes rigorous quality assurance and cutting-edge design methodologies, ensuring each device meets stringent performance and durability standards. The CE2G101Z00 reflects the brand??s commitment to supporting engineers and sourcing specialists with components that enable efficient, high-performance electronic system designs.
FAQ
What is the maximum operating frequency of this device?
The device supports operation up to 1 GHz, making it suitable for high-speed digital signal processing applications where fast and accurate response is essential.
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Can this component operate in extreme temperature conditions?
Yes, it operates reliably within a temperature range from -40??C to +85??C, allowing deployment in harsh industrial environments and outdoor applications without performance degradation.
What package type does the CE2G101Z00 use?
This device comes in a surface mount package, facilitating easy integration into printed circuit boards and enabling automated assembly processes for efficient manufacturing.
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How does the power consumption of this component impact system design?
With a maximum power dissipation of 300 mW, the device helps reduce overall system power requirements, which contributes to better thermal management and energy