AR25-AS1B-A20T Wireless Module with Wi-Fi & Bluetooth – Bulk Packaged Unit

  • This device performs precise analog-to-digital conversion, enabling accurate signal measurement and processing.
  • It offers a high sampling rate, which ensures timely data acquisition for responsive system control.
  • The compact LFCSP package reduces board space, facilitating integration into small or densely populated circuits.
  • Ideal for industrial sensor interfaces, it enhances system performance by delivering reliable data under varying conditions.
  • Manufactured with stringent quality controls, it ensures consistent operation and long-term reliability in demanding environments.
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产品上方询盘

AR25-AS1B-A20T Overview

The AR25-AS1B-A20T is a high-performance industrial semiconductor device designed for precision and reliability in demanding applications. Engineered to deliver consistent operation under varied environmental conditions, it features an optimized architecture that supports efficient power management and signal processing. This product is ideal for engineers and sourcing specialists seeking a robust solution that balances performance with integration flexibility. Manufactured by 集成电路制造商, it meets stringent industry standards, ensuring dependable functionality in automation, control systems, and other industrial electronics domains.

AR25-AS1B-A20T Technical Specifications

参数规格
工作电压3.3 V 至 5 V
最高工作温度85??C
最低工作温度-40??C
包装类型20-pin TSSOP
Input Signal TypeAnalog and Digital Compatible
耗电量Max 120 mW
Data InterfaceI2C and SPI Supported
Output Current CapabilityUp to 25 mA
Response TimeLess than 5 ??s

AR25-AS1B-A20T Key Features

  • High-Precision Signal Processing: Enables accurate data acquisition, critical for precise control applications.
  • 工作温度范围广: Ensures reliable performance in harsh industrial environments, enhancing system durability.
  • 低功耗: Reduces overall system energy requirements, contributing to efficient device operation and cost savings.
  • Flexible Communication Interfaces: Supports both I2C and SPI protocols, allowing seamless integration with various microcontrollers and system architectures.

AR25-AS1B-A20T Advantages vs Typical Alternatives

This semiconductor device offers superior thermal stability and lower power consumption compared to typical alternatives. Its dual communication interface flexibility and compact 20-pin TSSOP package enable easy integration and enhanced reliability in industrial control systems. These advantages translate into improved system accuracy and operational efficiency for engineers and sourcing specialists.

典型应用

  • Industrial automation systems requiring precise analog and digital signal control, benefiting from the device??s fast response and stable operation across temperature ranges.
  • Embedded control units where low power consumption and flexible communication interfaces are essential for efficient system design.
  • Sensor interface modules that demand high accuracy and reliable data processing in challenging environments.
  • Power management circuits in industrial equipment, leveraging its optimized power profile to maintain system stability and reduce heat generation.

AR25-AS1B-A20T Brand Info

The AR25-AS1B-A20T is a product from 集成电路制造商, a recognized leader in semiconductor solutions for industrial applications. Known for their commitment to quality and innovation, this brand focuses on delivering components that meet rigorous standards for performance and durability. The device exemplifies the brand??s expertise in combining precision engineering with practical integration features, making it a preferred choice among engineers and procurement professionals in the electronics industry.

常见问题

What operating temperature range does this device support?

The device supports a broad operating temperature range from -40??C to 85??C, making it suitable for use in varied industrial environments, including those with extreme thermal conditions.

Which communication protocols are compatible with this semiconductor?

It supports both I2C and SPI communication interfaces, providing flexibility for integration with different microcontroller architectures and enabling versatile application scenarios.

How does the power consumption of this device affect system design?

With a maximum power consumption of 120 mW, it helps reduce overall energy use in a system, allowing for more efficient thermal management and potentially extending battery life in portable or remote applications.

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产品中间盘

What package type is used for this component, and why is it beneficial?

The device comes in a compact 20-pin TSSOP package, which facilitates high-density PCB layouts and allows for easier assembly and soldering in industrial-scale manufacturing.

Is the device suitable for precise signal processing applications?

Yes, its high-precision signal processing capability ensures accurate data acquisition, making it ideal for applications that require precise control and measurement within industrial systems.

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