MR2A16ATS35CR – High-Performance Memory Module, 16GB, DIMM Package

  • MR2A16ATS35CR is designed for efficient data processing, enhancing system performance.
  • It features a high-speed interface, ensuring quick communication between components.
  • Compact package type allows for significant board-space savings, optimizing design layouts.
  • Ideal for embedded systems, facilitating seamless operation in various applications.
  • Manufactured with stringent quality standards, ensuring reliable and consistent performance.
SKU: MR2A16ATS35CR 类别 标签 , , 品牌:
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MR2A16ATS35CR Overview

The MR2A16ATS35CR is a high-performance semiconductor device designed for a variety of industrial applications. This product offers exceptional reliability and efficiency, making it ideal for demanding environments. With its advanced technology, the MR2A16ATS35CR ensures optimal performance while minimizing power consumption. Industries can benefit from its robust features and compatibility with existing systems, enabling seamless integration into various electronic designs. For more details, visit 集成电路制造商.

MR2A16ATS35CR Key Features

  • High processing speed that enhances overall system performance, allowing for rapid data handling.
  • Low power consumption, which helps reduce operational costs and prolongs device lifespan.
  • Robust temperature tolerance, ensuring reliable operation in harsh environments and reducing the risk of failure.
  • Flexible interface options that simplify integration into a wide range of applications.

MR2A16ATS35CR Technical Specifications

参数价值
电源电压3.3 V 至 5 V
工作温度范围-40°C 至 +85°C
数据速率Up to 1 Gbps
输入电压范围0 V to 5 V
输出电压0 V to 5 V
包装类型QFN
针数16
Mounting TypeSurface Mount

MR2A16ATS35CR Advantages vs Typical Alternatives

This semiconductor device stands out against typical alternatives by offering superior sensitivity and accuracy, which are crucial for industrial applications. Its low power consumption also sets it apart, ensuring long-term reliability and efficiency in various electronic systems.

典型应用

  • Industrial automation systems, where reliable data processing and low power consumption are essential for operational efficiency and cost savings.
  • Consumer electronics, providing high-speed processing capabilities that enhance user experience.
  • Automotive applications, ensuring dependable performance in critical systems such as safety and engine management.
  • Telecommunications, where robust data handling supports seamless communication and connectivity.

MR2A16ATS35CR Brand Info

The MR2A16ATS35CR is a product of a trusted manufacturer known for delivering high-quality semiconductor solutions. This device embodies the latest advancements in semiconductor technology, ensuring it meets the rigorous demands of modern industrial applications. Its design prioritizes efficiency, reliability, and ease of integration, making it a preferred choice for engineers and sourcing specialists alike.

常见问题

What is the operating temperature range of the MR2A16ATS35CR?

The operating temperature range of this semiconductor device is from -40??C to +85??C, making it suitable for various environments, including extreme conditions.

How does the MR2A16ATS35CR improve energy efficiency?

This device is designed with low power consumption in mind, which not only reduces operational costs but also contributes to a longer lifespan of the equipment in which it is used.

What types of applications can benefit from the MR2A16ATS35CR?

The MR2A16ATS35CR is suitable for industrial automation, consumer electronics, automotive systems, and telecommunications, among others, due to its versatile features and reliable performance.

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Can the MR2A16ATS35CR be easily integrated into existing systems?

Yes, this device offers flexible interface options, making it straightforward to integrate into a wide range of electronic applications without extensive modifications.

What is the significance of the package type for the MR2A16ATS35CR?

The QFN package type allows for a compact design and efficient thermal management, which is critical for maintaining performance in high-density applications.

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