Technology Never Stands Still—and Neither Do We
Validated Mini-ITX platforms engineered for reliable deployment in industrial, edge, and embedded system environments.
Build with Precision. Explore Verified Product Specs
Every board we build is backed by engineering-grade documentation. From I/O port definitions to mechanical cutouts and thermal limits—you’ll find all the specs you need here to integrate, validate, and scale with confidence.
Whether you’re designing the housing, reviewing BIOS options, or checking connector clearance, this page brings all your answers into one place.
Whether you’re designing the housing, reviewing BIOS options, or checking connector clearance, this page brings all your answers into one place.
Find Specs by Product Family or Form Factor
Choose the product platform that matches your use case. Each category provides detailed spec sheets, mechanical drawings, I/O descriptions, and environmental ratings for your chosen model.
Mini-ITX Series
Full-size boards, maximum expandability
These 170x170mm platforms offer extensive I/O, dual LAN, wide voltage input, and rich BIOS customization—ideal for industrial automation, digital signage, and fanless PCs.
3.5” SBC Boards
Small footprint, strong performance
With space-saving layouts and onboard SoCs, these compact 146x102mm boards are perfect for embedded systems where thermal control, power efficiency, and modular design matter.
Fanless Embedded Systems
Integration-ready and thermally validated
Our pre-assembled systems combine mainboard, heatsink, enclosure, and power supply—fully tested for passive cooling in sealed environments, suited for medical, retail, or transport systems.
Custom/ODM Boards
Built for you, from BIOS to back panel
These bespoke PCBA boards are co-designed for clients needing specialized form factors, I/O pinouts, or power profiles. Engineering drawings and lifecycle documents included.
Compare Core Specs Across Our Most Popular Boards
This table helps you compare CPU type, I/O layout, dimensions, power input, and more—so you can quickly shortlist the right board for your project, enclosure, or compliance requirement.
| Model | CPU / Chipset | Memory | Storage | I/O Ports | DC Input | Size (mm) | Temp Range |
|---|---|---|---|---|---|---|---|
| MI-2100T | Intel® Core™ i5-1245UE / H610 | 2x DDR4 SO-DIMM | 1x M.2 2280, 1x SATA | 6x USB, 2x LAN, HDMI, 2x COM | 12V / 19V | 170×170 | 0–60°C |
| MI-1900N | Intel® N100 / Alder Lake-N | 1x DDR4 SO-DIMM | 1x M.2 + 1x SATA | 4x USB, 1x HDMI, 2x COM | 12V | 170×120 | 0–60°C |
| SBC-A320 | AMD Ryzen™ V1605B / SoC | 4GB LPDDR4 onboard | 1x SATA, eMMC | 4x USB, 1x LAN, DP, GPIO | 9–24V DC | 146×102 | -20–70°C |
| SBC-N5095 | Intel® Celeron® N5095 / SoC | 1x DDR4 SO-DIMM | 1x SATA, 1x M.2 | 6x USB, HDMI, COM, DP | 12–24V | 146×102 | 0–60°C |
| X9-FNLS | Intel® N95 / SoC | 1x DDR4 | 1x M.2 SSD | 6x USB, 2x HDMI, 2x COM | 12V only | 170×120 | 0–60°C |
| ODM-ITX-CML | Intel® Core™ i3-10110U / Q370 | 2x DDR4 | 2x SATA, 1x M.2 | 8x USB, 2x COM, DP, LAN | 12–28V | 170×170 | -20–70°C |
Need Help Matching Specs to Your Project?
Whether you’re comparing CPUs, checking form factors, or planning I/O needs—our engineering team can help you validate compatibility or suggest the best board fit.
Drill into Each Board’s Engineering Details
Each product below includes downloadable files and key mechanical and electrical data—ready for enclosure planning, BIOS prep, and power validation.
MI-2100T – Intel® Core™ i5-1245UE Thin Mini-ITX Board
A rugged 3.5-inch board built for industrial graphics and multi-display kiosks.
Optimized for edge applications that need visual output, fanless cooling, and low power draw in tight spaces.
Intel® 12th Gen Alder Lake Performance
Designed for compute-intensive edge applications, this board features high-efficiency cores and modern chipset architecture.
Memory & Storage Flexibility
Supports fast and scalable configurations for multi-tasking and data logging.
Rich I/O Interfaces for Integration
Engineered for kiosk, automation, and retail system builders.
Wide-Range DC Input
Built for power stability across industrial voltage conditions.
Industrial-Grade Features
Made for long-life deployments with smart system control.
SBC-A320 – AMD Ryzen™ V1605B 3.5″ SBC
A full-featured Mini-ITX platform for fanless enclosures and high-I/O workloads.
Ideal for digital signage, AI boxes, and system integrators needing stable BIOS and thermal flexibility.
Embedded Quad-Core AMD Ryzen V1605B
Optimized for high-resolution graphics and multitasking at the edge.
Onboard Memory with eMMC Option
Pre-integrated for stable performance and simplified design.
Multiple Display & I/O Interfaces
Perfect for HMI, kiosk, and automation display systems.
Wide DC Input & Industrial Range
Handles power instability and thermal cycling in field deployments.
X9-FNLS – Intel® N95 Thin Mini-ITX
A cost-effective Mini-ITX board with Intel N95, fit for POS and automation terminals.
Its simplified 12V input, rich USB layout, and silent performance make it suitable for edge deployment.
Intel N95 Jasper Lake CPU for Low-Power Applications
Efficient and quiet for cost-effective embedded computing.
Flexible RAM & Storage Interfaces
Supports modern NVMe storage and fanless OS builds.
Standard Rich I/O Layout for Entry-Level Systems
Stable, compact, and reliable in POS or thin client environments.
12V DC Input Only
Simplifies power design for kiosks, terminals, and vehicles.
Thermal & Power Design Info
Whether your system is built around high-efficiency Intel® Core™ CPUs, low-power N-series processors, or performance-grade AMD Ryzen™ SoCs, our Mini-ITX and 3.5” boards are engineered for stable operation in fanless, space-constrained, or rugged deployments.
Power Input & Stability
Thermal Design Approach
Whether your system is built around high-efficiency Intel® Core™ CPUs, low-power N-series processors, or performance-grade AMD Ryzen™ SoCs, our Mini-ITX and 3.5” boards are engineered for stable operation in fanless, space-constrained, or rugged deployments.
Designed for TDP ranges from 6W to 35W
Deployment Guidelines
Tip: When designing fanless enclosures, always validate thermal contact zones and consider adding copper interface pads or thermal gels for better dissipation.
System-level power and cooling strategies
Mechanical & I/O Layout Integration
When you’re working with slim enclosures, VESA mounts, or custom metal housings, our Mini-ITX and 3.5″ boards are designed to make installation predictable and error-free.
Mechanical Design Highlights
Board mounting holes follow Mini-ITX or 3.5” SBC standard for easy integration into chassis
I/O Port Placement Guide
USB, HDMI, LAN, and COM port locations are aligned for rear-panel breakout
What It Helps Solve
Reduces errors when aligning ports to enclosures
Avoids blocked airflow or connector interference
Speeds up the time from test-bench to field installation
From Specs to Success: Blog Insights for Engineers
Get behind the datasheets. Our blog explores how each spec choice impacts thermal balance, power stability, and I/O integrity in the field. Learn from real integration scenarios and design trade-offs.
Intel Celeron N150: Balancing Power, Performance, and Practical Efficiency in Compact Systems
Table of Contents 1. Introduction: The Role of the N150 in Modern Embedded Platforms 2. CPU Microarchitecture and Platform Integration 3. Thermal Design and Power Consumption in Real Deployments 4.…
Intel Celeron N300: Engineering Low-Power Performance for Modern Embedded Systems
Table of Contents Introduction: The N300’s Place in Embedded and SFF Markets Architecture & SoC Integration Power Consumption & Idle Realities BIOS & Tuning for Sustained Performance Thermal Performance &…